|
性 别: |
男 |
出生年月: |
1979年6月13日 |
|
年 龄: |
|
婚姻状况: |
未婚 |
|
体 重: |
75 |
身 高: |
177 |
|
国 家: |
china |
文化程度: |
硕士 |
|
主修专业: |
热能与动力工程 |
薪资意向: |
50000 |
| 应聘职位1: |
机械工程师 |
应聘职位2: |
计算机软件工程师-应用程序 |
|
毕业日期: |
2004年7月 |
在读/毕业院校: |
南京理工大学 |
|
个人简介: |
I am working as a thermal and mechanical engineer in Huawei at present. During the years in this company, I am responsible for the thermal design of the new products, including router, wireless, access, transmission and the research of new thermal technologies. The products include cabinets, racks, shelves and boxes with forced convection and natural convection cooling.
As a project leader, I manage a thermal team with a staff of 10 people, analyzing the criteria of the thermal and environmental aspects for the new developing products, determining the requirements and specifications for the new products, doing the thermal design for the new developing products, solving the thermal problems of the existing products and improving their thermal solutions. My business covers all the levels of the engineering design from the design of system architecture to the PCB boards design and the chips or modules design, such as optical modules.
With more than 4 years experience in the engineering design of the electronic products, I am familiar with the product development process and able to undertake the developing task of new products. Together with the overseas working experience, I am good at communicating with foreign people in English and ready to meet all kinds of challenges.
As a member of the cooperation project on thermal design for electronic equipments, I have been working in the R&D Center of Huawei in U.S. since Mar 2008.
I have attended the technology meeting of iMAPS (International Microelectronics and Packaging Society), which is about Advanced Technology on Thermal Management. And I also got my membership of ASME (American Society of Mechanical Engineers) when I attended its conference of IMECE (International Mechanical Congress and Exposition). Such experience really enriched my individual value and vision.
Working Skills
1. Familiar with the theory of heat transfer and fluid mechanics, CFD and NHT (Numerical Heat Transfer).
2. Performing the thermal solutions and evaluations in all the levels, from component level to PCB board level, from rack level to equipment room level, including thermal management in Date Center, system architecture design, thermal arrangement, fan selection, PCB layout, heat sink design and thermal optimization.
3. Proficient in the thermal analysis tools Flotherm, icepak, Fluent, etc. Expert in Flotherm. Able to perform complex thermal analysis to guide design.
4. Experience with the thermal testing (mockup test & verification test), flow resistance test and Acquaintance with the laboratory equipments.
5. Proficient in the international standard such as NEBS, ETSI, QM333, etc. Able to meet worldwide compliance requirements.
6. Familiar with the Environment test such as acoustical measurement, contaminant test.
7. Familiar with the mechanical design SW tools PRO/E, AutoCAD and the EDA SW tools Allegro.
8. Knowledge in sheet metal, plastic, mold and packaging design. Understanding the knowledge in structural analysis.
9. Understanding the Mechanical Design Verification Test.
10. Understanding of Safety Agency design criteria and EMC design techniques for modules and enclosures
11. Familiar with the Integrated Product Developing Procedure.
|
|